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ISL84467IRTZ-T - Renesas Electronics

Description: The Intersil ISL84467 device is a low ON-resistance, low voltage, bidirectional, Quad SPDT (Dual DPDT) analog switch designed to operate from a single +1. 65V to +4. 5V supply. Targeted applications include battery powered equipment that benefit from low rON (0. 39Ω) and fast switching speeds (tON = 33ns, tOFF = 16ns). The digital logic input is 1. 8V logic-compatible when using a single +3V supply. With a supply voltage of 4. 2V and logic high voltage of 2. 85V at both logic inputs, the part draws only 12µ

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ISL84467IRTZ-T - Renesas Electronics - PCB symbol
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PCB Footprints
ISL84467IRTZ-T - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 16 Ld 3x3 TQFN
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3D Models
ISL84467IRTZ-T - Renesas Electronics - 3D model - Quad Flat No-Lead - 16 Ld 3x3 TQFN
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ISL84467IRTZ-T Details

  • Manufacturer Part Number:

    ISL84467IRTZ-T

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TQFN

  • Pin Count:

    16

  • Manufacturer Package Code:

    L16.3X3A

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Date Of Intro:

    2017-10-23

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    8

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    S-PQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • On-state Resistance-Max (Ron):

    0.95 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Signal Current-Max:

    0.3 A

  • Supply Current-Max (Isup):

    0.013 mA

  • Supply Voltage-Max (Vsup):

    4.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

ISL84467IRTZ-T Frequently Asked Questions (FAQs)

  • A good PCB layout for the ISL84467IRTZ-T involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces between the IC and the capacitors. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure proper power-on and power-off, the device should be powered on and off slowly (within 10ms) to prevent voltage spikes. A soft-start circuit can be used to control the power-on sequence. Additionally, the device should be powered off by reducing the voltage slowly to prevent latch-up.
  • The recommended capacitors for the ISL84467IRTZ-T are X5R or X7R ceramic capacitors with a voltage rating of 10V or higher. The capacitors should be placed as close to the IC as possible to minimize parasitic inductance.
  • To handle ESD protection, it is recommended to use a TVS (Transient Voltage Suppressor) diode or a Zener diode with a voltage rating of 10V or higher. The ESD protection device should be placed as close to the IC as possible.
  • To ensure proper thermal management, the device should be mounted on a PCB with a thermal pad connected to a solid ground plane. A thermal interface material (TIM) can be used to improve heat transfer between the device and the heat sink.

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ISL84467IRTZ-T Overview

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