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ISL84781IVZ-T - Renesas Electronics

Description: The Intersil ISL84781 device contains precision, bidirectional, analog switches configured as an 8-channel multiplexer/demultiplexer. It is designed to operate from a single +1. 6V to +3. 6V supply. The device has an inhibit pin to simultaneously open all signal paths. ON-resistance is 0. 4Ω with a +3. 0V supply and 0. 55Ω with a single +1. 8V supply. Each switch can handle rail-to-rail analog signals. The off-leakage current is only 4nA max at +25°C or 40nA max at +85°C with a +3. 3V supply. All digital in

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ISL84781IVZ-T - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - (TSSOP)
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ISL84781IVZ-T - Renesas Electronics  - 3D model - Small Outline Packages - (TSSOP)
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ISL84781IVZ-T Details

  • Manufacturer Part Number:

    ISL84781IVZ-T

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    M16.173

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Date Of Intro:

    2017-10-23

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Analog IC - Other Type:

    SINGLE-ENDED MULTIPLEXER

  • JESD-30 Code:

    R-PDSO-G16

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO

  • Number of Channels:

    1

  • Number of Functions:

    8

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    65 dB

  • On-state Resistance Match-Nom:

    0.12 Ω

  • On-state Resistance-Max (Ron):

    0.8 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.2 mm

  • Signal Current-Max:

    0.3 A

  • Supply Current-Max (Isup):

    0.012 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    1.6 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    25 ns

  • Switch-on Time-Max:

    27 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Terminal Finish:

    Pure Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

ISL84781IVZ-T Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout in the ISL84781EVKIT1Z evaluation kit documentation, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize EMI.
  • The ISL84781IVZ-T has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer between the device and the thermal plane. Additionally, the PCB should be designed to minimize thermal resistance and ensure good airflow around the device.
  • The recommended input capacitor value is 10uF to 22uF, with an X5R or X7R dielectric type. The capacitor should be placed as close as possible to the VIN pin and have a low ESR to minimize input voltage ripple and ensure stable operation.
  • The ISL84781IVZ-T has a resistive divider network that sets the output voltage. The output voltage can be adjusted by selecting the appropriate values for the R1 and R2 resistors. Renesas provides a calculation tool or a formula in the datasheet to determine the required resistor values for a specific output voltage.
  • The ISL84781IVZ-T has a maximum output current capability of 1.5A. However, the actual output current capability may be limited by the input voltage, output voltage, and thermal conditions. It is recommended to check the device's thermal and electrical performance under the specific application conditions.

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