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IXDD604SI - LITTELFUSE

Description: Gate Drivers 4A Dual Low-Side Ultrafast Mosfet DRV

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IXDD604SI Details

  • Manufacturer Part Number:

    IXDD604SI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    8.1

  • High Side Driver:

    NO

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    4 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    35 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    18 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.065 µs

  • Turn-on Time:

    0.065 µs

  • Width:

    3.9 mm

IXDD604SI Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the device should be connected to a large copper area on the PCB to dissipate heat efficiently. The copper area should be at least 1 inch x 1 inch in size and connected to a ground plane to minimize thermal resistance.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Also, consider using a heat sink or thermal interface material to reduce the thermal resistance between the device and the PCB.
  • The recommended soldering profile is a peak temperature of 260°C for 10-15 seconds, with a ramp-up rate of 3°C/s and a ramp-down rate of 6°C/s. This profile ensures reliable solder joints and minimizes thermal stress on the device.
  • Yes, the IXDD604SI is a high-reliability device that meets the requirements of AEC-Q101, making it suitable for use in automotive and other high-reliability applications.
  • The IXDD604SI has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing, such as using an ESD wrist strap or mat, and storing the devices in anti-static packaging.

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IXDD604SI Overview

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