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IXDD609SIATR - LITTELFUSE

Description: Driver 9A 1-OUT Low Side Non-Inv Automotive AEC-Q100 8-Pin SOIC T/R

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PCB Footprints
IXDD609SIATR - LITTELFUSE PCB footprint - Small Outline Packages - Small Outline Packages - SIA (8-PIN SOIC)
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3D Models
IXDD609SIATR - LITTELFUSE  - 3D model - Small Outline Packages - SIA (8-PIN SOIC)
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IXDD609SIATR Details

  • Manufacturer Part Number:

    IXDD609SIATR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    8.1

  • High Side Driver:

    NO

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    9 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    35 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    18 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.04 µs

  • Turn-on Time:

    0.055 µs

  • Width:

    3.9 mm

IXDD609SIATR Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a thermal pad on the bottom of the device and connect it to a large copper area on the PCB. This helps to dissipate heat efficiently. Additionally, keeping the PCB traces and vias away from the thermal pad can reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it is essential to follow the recommended derating curves for the device. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. It is also crucial to ensure good airflow and avoid thermal hotspots.
  • The IXDD609SIATR has an ESD rating of 2 kV human body model (HBM) and 150 V machine model (MM). To prevent ESD damage, handle the device with an anti-static wrist strap or mat, and avoid touching the pins or leads. Store the device in an anti-static bag or container when not in use.
  • The IXDD609SIATR is an industrial-grade device, but it may not meet the specific requirements for high-reliability or automotive applications. For such applications, consider using devices with higher reliability ratings, such as AEC-Q101 or MIL-PRF-19500 qualified devices.
  • The recommended soldering profile for the IXDD609SIATR is a peak temperature of 260°C (500°F) for 10-30 seconds. It is essential to follow the recommended soldering profile to prevent damage to the device.

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IXDD609SIATR Overview

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