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IXDN609SIATR - LITTELFUSE

Description: Driver 9A 1-OUT Lo Side Non-Inv Automotive 8-Pin SOIC T/R

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IXDN609SIATR - LITTELFUSE - PCB symbol
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IXDN609SIATR - LITTELFUSE PCB footprint - Small Outline Packages - Small Outline Packages - SIA (8-Pin SOIC)-ren1
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IXDN609SIATR - LITTELFUSE - 3D model - Small Outline Packages - SIA (8-Pin SOIC)-ren1
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IXDN609SIATR Details

  • Manufacturer Part Number:

    IXDN609SIATR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    8.1

  • High Side Driver:

    NO

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    9 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    35 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    18 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.04 µs

  • Turn-on Time:

    0.055 µs

  • Width:

    3.9 mm

IXDN609SIATR Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXDN609SIATR is a standard SOT23-6 package with a 1.6mm x 1.6mm body size and a 0.5mm pitch. The datasheet provides a recommended land pattern and soldering guidelines.
  • To ensure proper biasing, connect the VIN pin to a stable voltage source, and the EN pin to a logic-level signal (e.g., 3.3V or 5V). The datasheet provides a recommended application circuit and biasing guidelines.
  • The maximum allowed power dissipation for the IXDN609SIATR is 1.4W at an ambient temperature of 25°C. The datasheet provides a thermal derating curve to ensure safe operation.
  • The IXDN609SIATR is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. Consult the datasheet for thermal characteristics and derating guidelines.
  • Handle the IXDN609SIATR with ESD-protective equipment and follow proper ESD-handling procedures. The datasheet recommends using an ESD-protective wrist strap or mat when handling the device.

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IXDN609SIATR Overview

Use the download button to access the IXDN609SIATR schematic symbol, PCB footprint, and 3D model.
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