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IXFB210N30P3 - LITTELFUSE

Description: IXYS IXFB210N30P3 N-channel MOSFET Transistor, 210 A, 300 V, 3-Pin PLUS264

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Symbol
IXFB210N30P3 - LITTELFUSE - PCB symbol
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PCB Footprints
IXFB210N30P3 - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - IXFB110N60P3
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3D Models
IXFB210N30P3 - LITTELFUSE - 3D model - Transistor Outline, Vertical - IXFB110N60P3
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IXFB210N30P3 Details

  • Manufacturer Part Number:

    IXFB210N30P3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6.22

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    4000 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    300 V

  • Drain Current-Max (ID):

    210 A

  • Drain-source On Resistance-Max:

    0.0145 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    42 pF

  • JESD-30 Code:

    R-PSIP-T3

  • JESD-609 Code:

    e1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1890 W

  • Pulsed Drain Current-Max (IDM):

    550 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXFB210N30P3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXFB210N30P3 is a standard TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm. It's recommended to follow the PCB layout guidelines provided in the datasheet or application notes to ensure proper thermal performance and reliability.
  • To ensure proper cooling, it's recommended to provide a heat sink with a thermal resistance of less than 1°C/W and a surface area of at least 10cm². The heat sink should be mounted using a thermal interface material (TIM) with a thermal conductivity of at least 1W/m-K. Additionally, ensure good airflow around the heat sink and avoid blocking the airflow with other components or obstacles.
  • The maximum allowed case temperature for the IXFB210N30P3 is 150°C. Operating the device above this temperature can reduce its reliability and lifespan. It's recommended to design the system to keep the case temperature below 125°C to ensure optimal performance and reliability.
  • The IXFB210N30P3 is a commercial-grade device and may not meet the requirements for high-reliability or aerospace applications. Littelfuse Inc offers other devices that are specifically designed and qualified for high-reliability and aerospace applications. It's recommended to contact Littelfuse Inc or a qualified distributor for more information on these devices.
  • To protect the IXFB210N30P3 from EOS and ESD, it's recommended to follow proper handling and storage procedures, such as using anti-static bags and wrist straps. In the circuit design, consider adding TVS diodes or other protection devices to absorb voltage transients and spikes. Additionally, ensure that the device is properly soldered and that the PCB is designed to minimize electrical noise and transients.

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IXFB210N30P3 Overview

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