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IXFH16N50P3 - LITTELFUSE

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IXFH16N50P3 - LITTELFUSE  - 3D model
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IXFH16N50P3 Details

  • Manufacturer Part Number:

    IXFH16N50P3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    300 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    500 V

  • Drain Current-Max (ID):

    16 A

  • Drain-source On Resistance-Max:

    0.36 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    7 pF

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    330 W

  • Pulsed Drain Current-Max (IDM):

    40 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXFH16N50P3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for IXFH16N50P3 is a standard SOT-223 package with a minimum pad size of 2.5mm x 2.5mm and a thermal pad size of 3.5mm x 3.5mm.
  • Yes, IXFH16N50P3 is rated for operation up to 150°C junction temperature, making it suitable for high-temperature applications. However, derating may be necessary for prolonged exposure to high temperatures.
  • To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a soldering flux compatible with the component's lead finish. Avoid overheating or applying excessive force, which can damage the component.
  • The maximum surge current rating for IXFH16N50P3 is 160A for 10ms, making it suitable for applications with high inrush currents.
  • Yes, IXFH16N50P3 can be used in a parallel configuration to increase the overall current handling capability. However, ensure that the components are properly matched and that the PCB design takes into account the increased current and thermal requirements.

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IXFH16N50P3 Overview

Use the download button to access the IXFH16N50P3 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like IXFH1, or try a keyword search, such as Power Field-Effect Transistors

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