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IXFH52N30P - LITTELFUSE

Description: N-Channel 300 V 52A (Tc) 400W (Tc) Through Hole TO-247AD (IXFH)

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PCB Footprints
IXFH52N30P - LITTELFUSE PCB footprint - Other - Other - TO-247 (IXFH)_2025-1
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3D Models
IXFH52N30P - LITTELFUSE  - 3D model - Other - TO-247 (IXFH)_2025-1
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IXFH52N30P Details

  • Manufacturer Part Number:

    IXFH52N30P

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-247, 3 PIN

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    1000 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    300 V

  • Drain Current-Max (ID):

    52 A

  • Drain-source On Resistance-Max:

    0.073 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    130 pF

  • JEDEC-95 Code:

    TO-247AD

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    400 W

  • Pulsed Drain Current-Max (IDM):

    150 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXFH52N30P Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for IXFH52N30P is a TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • Yes, IXFH52N30P is a high-reliability device that meets the requirements of AEC-Q101, making it suitable for use in automotive and other high-reliability applications.
  • To ensure the thermal performance of IXFH52N30P, it is recommended to use a heat sink with a thermal resistance of less than 1°C/W and to ensure good thermal contact between the device and the heat sink.
  • The maximum allowed case temperature for IXFH52N30P is 150°C, and it is recommended to keep the case temperature below 125°C for optimal performance and reliability.
  • Yes, IXFH52N30P can be used in a parallel configuration to increase the current handling capability, but it is recommended to ensure that the devices are matched and that the thermal performance is maintained.

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IXFH52N30P Overview

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