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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for IXFK120N25P
- Part Number IXFK120N25P
- Manufacturer LITTELFUSE
- Last Modified Date Aug 2, 2021 10:22 PM UTC
- Pinout / Pin List Click Here (Member Only)
IXFK120N25P Details
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Manufacturer Part Number:
IXFK120N25P
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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ECCN Code:
EAR99
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Manufacturer:
Littelfuse Inc
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YTEOL:
5.92
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Additional Feature:
AVALANCHE RATED
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Avalanche Energy Rating (Eas):
2500 mJ
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Case Connection:
DRAIN
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Configuration:
SINGLE WITH BUILT-IN DIODE
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DS Breakdown Voltage-Min:
250 V
IXFK120N25P Frequently Asked Questions (FAQs)
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The recommended PCB footprint for the IXFK120N25P is a TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
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Yes, the IXFK120N25P is suitable for high-frequency switching applications up to 100 kHz, but it's essential to consider the device's switching losses, thermal performance, and layout to ensure reliable operation.
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To ensure proper cooling, provide a sufficient heat sink with a thermal resistance of less than 1°C/W, and ensure good thermal contact between the device and the heat sink. Also, consider the airflow and ambient temperature in your design.
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The maximum allowed case temperature for the IXFK120N25P is 150°C, but it's recommended to keep the case temperature below 125°C for reliable operation and to prevent thermal runaway.
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Yes, you can parallel multiple IXFK120N25P devices to increase current handling, but it's essential to ensure that the devices are properly matched, and the gate drive and layout are designed to minimize current imbalance and oscillations.
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IXFK120N25P Overview
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