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IXFK170N10P - LITTELFUSE

Description: Trans MOSFET N-CH 100V 170A 3-Pin(3+Tab) TO-264AA

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IXFK170N10P - LITTELFUSE - PCB symbol
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PCB Footprints
IXFK170N10P - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - IXFK170N10P-96
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3D Models
IXFK170N10P - LITTELFUSE - 3D model - Transistor Outline, Vertical - IXFK170N10P-96
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IXFK170N10P Details

  • Manufacturer Part Number:

    IXFK170N10P

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.3

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    2000 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    170 A

  • Drain-source On Resistance-Max:

    0.009 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-264AA

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    715 W

  • Pulsed Drain Current-Max (IDM):

    350 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXFK170N10P Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXFK170N10P is a standard TO-220 package with a minimum pad size of 0.2 inches (5 mm) x 0.15 inches (3.8 mm) and a thermal pad size of 0.2 inches (5 mm) x 0.2 inches (5 mm).
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes thermal stress, such as reflow soldering or wave soldering.
  • The maximum allowed thermal resistance for the IXFK170N10P is 1.5°C/W (junction-to-case) and 3.5°C/W (junction-to-ambient) at a maximum operating temperature of 150°C.
  • Yes, the IXFK170N10P is suitable for high-reliability and aerospace applications, but it is recommended to consult with Littelfuse Inc. for specific requirements and testing protocols.
  • Handle the IXFK170N10P with ESD-protective equipment, such as wrist straps, mats, and bags, to prevent damage from electrostatic discharge. Ensure that the workspace is ESD-safe and follow proper handling procedures.

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IXFK170N10P Overview

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