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IXFK250N10P - LITTELFUSE

Description: MOSFET N-CH 100V 250A TO264AA

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PCB Footprints
IXFK250N10P - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-264 (IXFK)
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3D Models
IXFK250N10P - LITTELFUSE  - 3D model - Transistor Outline, Vertical - TO-264 (IXFK)
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IXFK250N10P Details

  • Manufacturer Part Number:

    IXFK250N10P

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.3

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    3000 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    250 A

  • Drain-source On Resistance-Max:

    0.0065 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-264AA

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1250 W

  • Pulsed Drain Current-Max (IDM):

    700 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXFK250N10P Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXFK250N10P is a TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • The IXFK250N10P is rated for operation up to 150°C, but it's recommended to derate the power dissipation at higher temperatures to ensure reliable operation. Consult the datasheet for thermal derating curves.
  • Use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Ensure the component is properly aligned and the solder joints are clean and free of oxidation.
  • The IXFK250N10P is rated for a maximum surge current of 250A for 10ms, but it's recommended to consult the datasheet for specific surge current ratings and duration.
  • Yes, the IXFK250N10P can be used in a parallel configuration, but it's essential to ensure that the devices are properly matched and the PCB layout is designed to minimize current imbalance and thermal gradients.

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IXFK250N10P Overview

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