The recommended PCB footprint for IXFN210N30P3 is a standard TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
Yes, IXFN210N30P3 is a high-reliability device that meets the requirements of AEC-Q101, making it suitable for use in automotive and other high-reliability applications.
To ensure the thermal performance of IXFN210N30P3, it is recommended to use a heat sink with a thermal resistance of less than 1°C/W and to ensure good thermal contact between the device and the heat sink.
The maximum allowed case temperature for IXFN210N30P3 is 150°C, and it is recommended to keep the case temperature below 125°C for optimal performance and reliability.
Yes, IXFN210N30P3 can be used in a parallel configuration to increase the current handling capability, but it is recommended to ensure that the devices are matched and that the current sharing is balanced to avoid overheating and reliability issues.
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
IXFN210N30P3 Overview
Use the download button to access the IXFN210N30P3 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like IXFN2,
or try a keyword search, such as Power Field-Effect Transistors
