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IXFN320N17T2 - LITTELFUSE

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IXFN320N17T2 - LITTELFUSE  - 3D model
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IXFN320N17T2 Details

  • Manufacturer Part Number:

    IXFN320N17T2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-227B, 4 PIN

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    5000 mJ

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    170 V

  • Drain Current-Max (ID):

    260 A

  • Drain-source On Resistance-Max:

    0.0052 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    410 pF

  • JESD-30 Code:

    R-PUFM-X4

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1070 W

  • Pulsed Drain Current-Max (IDM):

    800 A

  • Reference Standard:

    UL RECOGNIZED

  • Surface Mount:

    NO

  • Terminal Form:

    UNSPECIFIED

  • Terminal Position:

    UPPER

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXFN320N17T2 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXFN320N17T2 is a standard TO-220 package with a minimum pad size of 70 mils x 70 mils. It's recommended to follow the land pattern recommended by Littelfuse Inc or IPC-7351 standards.
  • The IXFN320N17T2 is rated for operation up to 150°C junction temperature. However, it's recommended to derate the device's power handling capability at high temperatures to ensure reliable operation. Consult the datasheet for thermal derating curves.
  • To ensure proper soldering, follow the recommended soldering profile and use a solder with a melting point above 217°C. Apply a small amount of solder paste to the pads and use a reflow oven or a soldering iron with a temperature-controlled tip.
  • The recommended gate drive voltage for the IXFN320N17T2 is between 10V and 15V. However, the device can tolerate up to 20V gate drive voltage. It's essential to ensure the gate drive voltage is within the recommended range to prevent damage to the device.
  • Yes, the IXFN320N17T2 can be used in a parallel configuration to increase the overall current handling capability. However, it's essential to ensure that the devices are properly matched and that the gate drive signals are synchronized to prevent uneven current sharing.

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IXFN320N17T2 Overview

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