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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for IXFN32N100P
- Part Number IXFN32N100P
- Manufacturer LITTELFUSE
- Last Modified Date Aug 2, 2021 10:22 PM UTC
- Pinout / Pin List Click Here (Member Only)
IXFN32N100P Details
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Manufacturer Part Number:
IXFN32N100P
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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ECCN Code:
EAR99
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Manufacturer:
Littelfuse Inc
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YTEOL:
6
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Additional Feature:
AVALANCHE RATED
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Avalanche Energy Rating (Eas):
1500 mJ
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Case Connection:
ISOLATED
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Configuration:
SINGLE WITH BUILT-IN DIODE
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DS Breakdown Voltage-Min:
1000 V
IXFN32N100P Frequently Asked Questions (FAQs)
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The recommended PCB footprint for the IXFN32N100P is a standard TO-220 package footprint with a minimum pad size of 0.2 inches x 0.2 inches and a thermal pad size of 0.4 inches x 0.4 inches.
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The IXFN32N100P is rated for operation up to 150°C, but it's recommended to derate the device's current and voltage ratings at higher temperatures to ensure reliable operation. Consult the datasheet for specific derating guidelines.
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To ensure proper soldering, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes thermal stress on the device, and avoid applying excessive force or pressure during soldering.
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The recommended wire size for connecting the IXFN32N100P to the PCB is 18 AWG to 20 AWG, depending on the specific application and current requirements. Ensure the wire is rated for the maximum operating temperature of the device.
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Yes, the IXFN32N100P can be used in a parallel configuration to increase current handling, but it's essential to ensure that the devices are properly matched and that the PCB layout is designed to minimize thermal and electrical differences between the devices.
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IXFN32N100P Overview
Use the download button to access the IXFN32N100P 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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