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IXFN40N90P - LITTELFUSE

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IXFN40N90P - LITTELFUSE  - 3D model
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IXFN40N90P Details

  • Manufacturer Part Number:

    IXFN40N90P

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    1500 mJ

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    900 V

  • Drain Current-Max (ID):

    33 A

  • Drain-source On Resistance-Max:

    0.21 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PUFM-X4

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    695 W

  • Pulsed Drain Current-Max (IDM):

    80 A

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Surface Mount:

    NO

  • Terminal Finish:

    Nickel (Ni)

  • Terminal Form:

    UNSPECIFIED

  • Terminal Position:

    UPPER

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXFN40N90P Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXFN40N90P is a TO-220 package with a minimum pad size of 0.2 inches x 0.2 inches and a thermal pad size of 0.4 inches x 0.4 inches.
  • Yes, the IXFN40N90P is a high-reliability device that meets the requirements of AEC-Q101, making it suitable for use in automotive and other high-reliability applications.
  • To ensure proper cooling, the IXFN40N90P should be mounted on a heat sink with a thermal resistance of less than 1°C/W. Additionally, the device should be placed in a location with good airflow to help dissipate heat.
  • The maximum allowed case temperature for the IXFN40N90P is 150°C, as specified in the datasheet.
  • Yes, the IXFN40N90P can be used in a parallel configuration to increase current handling, but it is recommended to ensure that the devices are properly matched and that the thermal management is adequate to handle the increased power dissipation.

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IXFN40N90P Overview

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