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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for IXFP60N25X3
- Part Number IXFP60N25X3
- Manufacturer LITTELFUSE
- Last Modified Date Aug 2, 2021 10:22 PM UTC
- Pinout / Pin List Click Here (Member Only)
IXFP60N25X3 Details
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Manufacturer Part Number:
IXFP60N25X3
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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ECCN Code:
EAR99
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Manufacturer:
Littelfuse Inc
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YTEOL:
5.92
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Additional Feature:
AVALANCHE RATED
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Avalanche Energy Rating (Eas):
700 mJ
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Case Connection:
DRAIN
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Configuration:
SINGLE WITH BUILT-IN DIODE
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DS Breakdown Voltage-Min:
250 V
IXFP60N25X3 Frequently Asked Questions (FAQs)
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The recommended PCB footprint for the IXFP60N25X3 is a standard TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
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Yes, the IXFP60N25X3 is suitable for high-frequency switching applications up to 100 kHz, but it's essential to consider the device's switching losses, thermal performance, and layout to ensure reliable operation.
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To ensure proper cooling, provide a sufficient heat sink with a thermal resistance of ≤ 1°C/W, and ensure good thermal contact between the device and the heat sink. Also, consider the maximum junction temperature (Tj) of 150°C and the thermal derating curve.
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The recommended gate drive voltage for the IXFP60N25X3 is between 10V and 15V, with a maximum gate-source voltage of ±20V. A higher gate drive voltage can improve switching performance, but be careful not to exceed the maximum rating.
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Yes, you can parallel multiple IXFP60N25X3 devices to increase current handling, but it's crucial to ensure that each device has an identical thermal environment and that the gate drive signals are properly synchronized to prevent uneven current sharing.
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IXFP60N25X3 Overview
Use the download button to access the IXFP60N25X3 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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