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IXFT150N30X3HV - LITTELFUSE

Description: IXFT150N30X3HV

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IXFT150N30X3HV - LITTELFUSE - PCB symbol
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IXFT150N30X3HV - LITTELFUSE PCB footprint - Other - Other - IXFT150N30X3HV-2
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IXFT150N30X3HV - LITTELFUSE - 3D model - Other - IXFT150N30X3HV-2
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IXFT150N30X3HV Details

  • Manufacturer Part Number:

    IXFT150N30X3HV

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.95

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    2000 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    300 V

  • Drain Current-Max (ID):

    150 A

  • Drain-source On Resistance-Max:

    0.0083 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    1.7 pF

  • JEDEC-95 Code:

    TO-268AA

  • JESD-30 Code:

    R-PSSO-G2

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    890 W

  • Pulsed Drain Current-Max (IDM):

    400 A

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXFT150N30X3HV Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXFT150N30X3HV is a TO-247-3L package with a minimum pad size of 6.5mm x 5.5mm and a thermal pad size of 10mm x 10mm.
  • Yes, the IXFT150N30X3HV is designed for high-reliability applications and meets the requirements of AEC-Q101, a standard for automotive-grade components.
  • To ensure proper cooling, the IXFT150N30X3HV should be mounted on a heat sink with a thermal resistance of less than 1°C/W. Additionally, the device should be placed in a location with good airflow to dissipate heat.
  • The maximum allowed case temperature for the IXFT150N30X3HV is 150°C, as specified in the datasheet.
  • Yes, the IXFT150N30X3HV can be used in a parallel configuration to increase current handling, but it is essential to ensure that the devices are properly matched and that the current sharing is balanced to avoid overheating.

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IXFT150N30X3HV Overview

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