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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for IXFX150N30P3
- Part Number IXFX150N30P3
- Manufacturer LITTELFUSE
- Last Modified Date Aug 2, 2021 10:22 PM UTC
- Pinout / Pin List Click Here (Member Only)
IXFX150N30P3 Details
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Manufacturer Part Number:
IXFX150N30P3
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Country Of Origin:
Philippines
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ECCN Code:
EAR99
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Manufacturer:
Littelfuse Inc
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YTEOL:
6
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Additional Feature:
AVALANCHE RATED
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Avalanche Energy Rating (Eas):
4000 mJ
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Case Connection:
DRAIN
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Configuration:
SINGLE WITH BUILT-IN DIODE
IXFX150N30P3 Frequently Asked Questions (FAQs)
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The recommended PCB footprint for the IXFX150N30P3 is a TO-220 package with a minimum pad size of 4.5mm x 4.5mm and a thermal pad size of 2.5mm x 2.5mm.
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The IXFX150N30P3 is rated for operation up to 150°C, but it's recommended to derate the power dissipation at higher temperatures. Consult the datasheet for thermal derating curves.
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Proper cooling can be achieved by using a heat sink with a thermal resistance of ≤ 1°C/W, and ensuring good thermal contact between the device and the heat sink. A thermal interface material (TIM) can also be used to improve heat transfer.
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The IXFX150N30P3 can withstand voltage transients up to 400V for a duration of ≤ 10ms. However, it's recommended to use a TVS diode or other protection devices to limit voltage transients and ensure device reliability.
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Yes, the IXFX150N30P3 can be used in a parallel configuration to increase the overall current handling capability. However, it's essential to ensure that the devices are properly matched and that the current sharing is balanced to avoid overheating and reduce reliability.
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IXFX150N30P3 Overview
Use the download button to access the IXFX150N30P3 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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