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IXFX360N15T2 - LITTELFUSE

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IXFX360N15T2 - LITTELFUSE  - 3D model
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IXFX360N15T2 Details

  • Manufacturer Part Number:

    IXFX360N15T2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Additional Feature:

    AVALANCHE RATED

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    150 V

  • Drain Current-Max (ID):

    360 A

  • Drain-source On Resistance-Max:

    0.004 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    665 pF

  • JESD-30 Code:

    R-PSIP-T3

  • JESD-609 Code:

    e1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1670 W

  • Pulsed Drain Current-Max (IDM):

    900 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXFX360N15T2 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXFX360N15T2 is a 5-pin TO-220 package with a minimum pad size of 2.5mm x 2.5mm and a maximum pad size of 5mm x 5mm. It's essential to follow the recommended footprint to ensure proper thermal performance and to prevent overheating.
  • Yes, the IXFX360N15T2 is suitable for high-reliability applications. It's designed and manufactured to meet the requirements of AEC-Q101, which ensures that the device can withstand the harsh conditions of the automotive industry. Additionally, Littelfuse provides a robust qualification and testing process to ensure the device's reliability.
  • To ensure proper cooling, it's essential to provide a sufficient heat sink and to follow the recommended thermal design guidelines. The IXFX360N15T2 has a thermal resistance of 2.5°C/W, and the maximum junction temperature is 150°C. A heat sink with a thermal resistance of 1°C/W or lower is recommended. Additionally, ensure good airflow and avoid blocking the airflow around the device.
  • The IXFX360N15T2 is rated for a maximum voltage of 15V, and it's not recommended to use it in high-voltage applications. If you need a device for high-voltage applications, consider using a different part number from Littelfuse, such as the IXFX360N30T2, which is rated for 30V.
  • The recommended storage temperature for the IXFX360N15T2 is -40°C to 125°C. It's essential to follow the recommended storage temperature to prevent damage to the device and to ensure its reliability.

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IXFX360N15T2 Overview

Use the download button to access the IXFX360N15T2 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like IXFX3, or try a keyword search, such as Power Field-Effect Transistors

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