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IXTA3N100D2HV - LITTELFUSE

Description: DISCMOSFET N-CH DEPL MODE-D2 TO-263D2 / TUBE

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IXTA3N100D2HV - LITTELFUSE - PCB symbol
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PCB Footprints
IXTA3N100D2HV - LITTELFUSE PCB footprint - Other - Other - IXTA3N100D2HV-2
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IXTA3N100D2HV - LITTELFUSE - 3D model - Other - IXTA3N100D2HV-2
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IXTA3N100D2HV Details

  • Manufacturer Part Number:

    IXTA3N100D2HV

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-263HV, 2 PIN

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • Drain-source On Resistance-Max:

    6 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    17 pF

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    DEPLETION MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    125 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

IXTA3N100D2HV Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXTA3N100D2HV is a standard TO-220 package with a minimum pad size of 4.5mm x 4.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • While the IXTA3N100D2HV is primarily designed for low-frequency applications, it can be used in high-frequency applications up to 100 kHz with proper PCB layout and design considerations. However, it's essential to consult with Littelfuse's application engineers for specific guidance.
  • To ensure proper cooling, it's recommended to provide a heat sink with a thermal resistance of ≤ 10°C/W and a minimum surface area of 10 cm². Additionally, ensure good airflow around the device and avoid blocking the heat sink fins.
  • The maximum allowed case temperature for the IXTA3N100D2HV is 150°C. Operating the device above this temperature can reduce its lifespan and affect its performance.
  • Yes, the IXTA3N100D2HV can be used in parallel to increase current handling, but it's essential to ensure that the devices are properly matched and that the current sharing is balanced. Consult with Littelfuse's application engineers for guidance on parallel operation.

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IXTA3N100D2HV Overview

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