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IXTF02N450 - LITTELFUSE

Description: N-Channel 4500 V 200mA (Tc) 78W (Tc) Through Hole ISOPLUS i4-PAC™

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Symbol
IXTF02N450 - LITTELFUSE - PCB symbol
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PCB Footprints
IXTF02N450 - LITTELFUSE PCB footprint - Other - Other - ISOPLUS i4-PakTM (HV) Outline_2024
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3D Models
IXTF02N450 - LITTELFUSE - 3D model - Other - ISOPLUS i4-PakTM (HV) Outline_2024
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IXTF02N450 Details

  • Manufacturer Part Number:

    IXTF02N450

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    I4PAK-3

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6.2

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    4500 V

  • Drain Current-Max (ID):

    0.2 A

  • Drain-source On Resistance-Max:

    750 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PSIP-T3

  • JESD-609 Code:

    e1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    78 W

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXTF02N450 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for IXTF02N450 is a TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • Yes, IXTF02N450 is rated for operation up to 150°C junction temperature, but it's recommended to derate the device's power handling capability at higher temperatures to ensure reliability.
  • To ensure reliability in a high-vibration environment, it's recommended to use a secure mounting method, such as screwing or clipping the device to the PCB, and to follow proper PCB design and assembly guidelines.
  • Yes, IXTF02N450 can be used in a parallel configuration to increase current handling, but it's essential to ensure that the devices are properly matched and that the PCB design and thermal management are adequate to handle the increased current.
  • The recommended gate drive voltage for IXTF02N450 is between 10V and 15V, with a maximum gate-source voltage of ±20V.

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IXTF02N450 Overview

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