The recommended PCB footprint for the IXTH52P10P is a standard TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
Yes, the IXTH52P10P is rated for operation up to 150°C, but it's recommended to derate the current handling capability at higher temperatures to ensure reliable operation.
Proper cooling can be achieved by providing a sufficient heat sink, ensuring good thermal contact between the device and the heat sink, and maintaining good airflow around the device.
The IXTH52P10P has a maximum surge current rating of 100A for 10ms, but it's recommended to consult the datasheet for specific surge current ratings and duration.
Yes, the IXTH52P10P can be used in a parallel configuration, but it's essential to ensure that the devices are properly matched and that the current sharing is balanced to avoid overheating and reduce reliability.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
IXTH52P10P Overview
Use the download button to access the IXTH52P10P schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like IXTH5,
or try a keyword search, such as Power Field-Effect Transistors
Suggested Parts
If you searched for IXTH52P10P, you might also be interested in these parts: