Part Image

IXTN40P50P - LITTELFUSE

Description: --

Download IXTN40P50P Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
3D Models
IXTN40P50P - LITTELFUSE  - 3D model
click to zoom
Note! To download footprints and symbols, use the build and request forms below

Build

Launch Build Wizard
Build Wizard not available for this package category!

Request (48 hours)

IXTN40P50P Details

  • Manufacturer Part Number:

    IXTN40P50P

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-227B, 4 PIN

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    3500 mJ

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE WITH BUILT-IN DIODE AND KELVIN SENSOR

  • DS Breakdown Voltage-Min:

    500 V

  • Drain Current-Max (ID):

    40 A

  • Drain-source On Resistance-Max:

    0.23 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    93 pF

  • JESD-30 Code:

    R-PUFM-X4

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    890 W

  • Pulsed Drain Current-Max (IDM):

    120 A

  • Reference Standard:

    UL RECOGNIZED

  • Surface Mount:

    NO

  • Terminal Finish:

    Nickel (Ni)

  • Terminal Form:

    UNSPECIFIED

  • Terminal Position:

    UPPER

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXTN40P50P Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for the IXTN40P50P can be found in the Littelfuse application note AN9313, which provides guidelines for PCB layout and assembly.
  • Follow the soldering and assembly guidelines outlined in the Littelfuse application note AN9313, which includes recommendations for soldering temperature, time, and techniques.
  • The IXTN40P50P has a high power dissipation capability, so thermal management is crucial. Ensure good heat sinking, use thermal interface materials, and follow the thermal design guidelines in the datasheet and application notes.
  • Yes, the IXTN40P50P is qualified to AEC-Q101 standards, making it suitable for high-reliability and automotive applications. However, ensure you follow the specific requirements and guidelines for your application.
  • Follow proper handling and storage procedures, use ESD protection devices, and ensure the PCB design includes protection circuits and layout guidelines to prevent EOS and ESD damage.

Trust Checks

No trust score is available for this model.
Trust Score Unavailable
Sponsored

IXTN40P50P Overview

Use the download button to access the IXTN40P50P 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like IXTN4, or try a keyword search, such as Power Field-Effect Transistors

Parts related to IXTN40P50P

Showing 0 results

Select Package Category

Package Categories

Datasheet PDF Preview