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IXTP05N100M - LITTELFUSE

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IXTP05N100M - LITTELFUSE  - 3D model
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IXTP05N100M Details

  • Manufacturer Part Number:

    IXTP05N100M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ISOLATED TO-220, 3 PIN

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    100 mJ

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    1000 V

  • Drain Current-Max (ID):

    0.7 A

  • Drain-source On Resistance-Max:

    17 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    8 pF

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    25 W

  • Pulsed Drain Current-Max (IDM):

    3 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXTP05N100M Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for IXTP05N100M is a standard TO-220 package with a minimum pad size of 2.5mm x 2.5mm and a thermal pad size of 4.5mm x 4.5mm.
  • Yes, IXTP05N100M is a high-reliability device that meets the requirements of AEC-Q101 and is suitable for use in automotive and other high-reliability applications.
  • To ensure the thermal performance of IXTP05N100M, it is recommended to use a heat sink with a thermal resistance of less than 1°C/W and to ensure good thermal contact between the device and the heat sink.
  • Yes, IXTP05N100M can be used in a parallel configuration to increase the current handling capability, but it is recommended to ensure that the devices are matched in terms of their electrical characteristics and that the thermal performance is not compromised.
  • The recommended storage temperature for IXTP05N100M is -40°C to 125°C, and it is recommended to store the devices in a dry, cool place away from direct sunlight.

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IXTP05N100M Overview

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