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IXTP130N10T - LITTELFUSE

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IXTP130N10T - LITTELFUSE  - 3D model
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IXTP130N10T Details

  • Manufacturer Part Number:

    IXTP130N10T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.3

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    500 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    130 A

  • Drain-source On Resistance-Max:

    0.0091 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    95 pF

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    360 W

  • Pulsed Drain Current-Max (IDM):

    350 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXTP130N10T Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXTP130N10T is a standard TO-220 package with a minimum pad size of 0.2 inches (5 mm) x 0.2 inches (5 mm) and a thermal pad size of 0.4 inches (10 mm) x 0.4 inches (10 mm).
  • Yes, the IXTP130N10T is qualified to AEC-Q101 standards, making it suitable for high-reliability and aerospace applications. However, it's essential to consult with Littelfuse Inc. for specific requirements and certifications.
  • To ensure proper soldering, follow the recommended soldering profile: peak temperature of 260°C (500°F), soldering time of 10-30 seconds, and a minimum solder wetting area of 80%. Additionally, use a solder with a melting point above 217°C (423°F).
  • The IXTP130N10T can withstand voltage transients up to 150% of the rated voltage (130V) for a duration of 100 ms, as per the datasheet. However, it's recommended to consult with Littelfuse Inc. for specific application requirements.
  • Yes, the IXTP130N10T can be used in a parallel configuration to increase current handling. However, it's essential to ensure that the devices are properly matched, and the PCB design takes into account the increased current and thermal requirements.

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IXTP130N10T Overview

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