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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for IXTP15P15T
- Part Number IXTP15P15T
- Manufacturer LITTELFUSE
- Last Modified Date Aug 2, 2021 10:22 PM UTC
- Pinout / Pin List Click Here (Member Only)
IXTP15P15T Details
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Manufacturer Part Number:
IXTP15P15T
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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ECCN Code:
EAR99
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Manufacturer:
Littelfuse Inc
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YTEOL:
5.85
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Additional Feature:
AVALANCHE RATED
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Avalanche Energy Rating (Eas):
300 mJ
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Case Connection:
DRAIN
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Configuration:
SINGLE WITH BUILT-IN DIODE
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DS Breakdown Voltage-Min:
150 V
IXTP15P15T Frequently Asked Questions (FAQs)
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The recommended PCB footprint for IXTP15P15T is a standard SOT-23 package with a minimum pad size of 0.8mm x 0.8mm and a maximum pad size of 1.2mm x 1.2mm, with a 0.5mm spacing between pads.
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Yes, IXTP15P15T is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the device is properly derated for temperature to avoid thermal runaway.
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To ensure the reliability of IXTP15P15T in high-reliability applications, follow proper handling and storage procedures, use a clean and dry assembly process, and perform thorough testing and inspection during manufacturing.
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Yes, IXTP15P15T can be used in parallel to increase current handling, but it's essential to ensure that the devices are properly matched and that the total current rating is not exceeded. Additionally, the user should consider the impact of parallel operation on the overall system reliability and thermal management.
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The recommended soldering profile for IXTP15P15T is a peak temperature of 260°C for 10-30 seconds, with a ramp-up rate of 3°C/s and a ramp-down rate of 6°C/s. It's essential to follow the recommended soldering profile to avoid damaging the device.
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IXTP15P15T Overview
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