The recommended PCB footprint for IXTP52P10P is a standard TO-220 package with a minimum pad size of 2.5mm x 2.5mm and a thermal pad size of 4.5mm x 4.5mm.
Yes, IXTP52P10P is a high-reliability device that meets the requirements of AEC-Q101, making it suitable for use in automotive and other high-reliability applications.
To ensure the thermal performance of IXTP52P10P, it is recommended to use a heat sink with a thermal resistance of less than 10°C/W and to ensure good thermal contact between the device and the heat sink.
Yes, IXTP52P10P is compatible with lead-free soldering processes and meets the requirements of RoHS and WEEE directives.
The maximum surge current rating of IXTP52P10P is 100A for 10ms, making it suitable for use in applications that require high surge current capability.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
IXTP52P10P Overview
Use the download button to access the IXTP52P10P schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like IXTP5,
or try a keyword search, such as Power Field-Effect Transistors