Part Image

IXTP76P10T - LITTELFUSE

Description: MOSFET -76 Amps -100V 0.024 Rds

Download IXTP76P10T Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
IXTP76P10T - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - to-220--ren1
click to zoom
3D Models
IXTP76P10T - LITTELFUSE  - 3D model - Transistor Outline, Vertical - to-220--ren1
click to zoom

IXTP76P10T Details

  • Manufacturer Part Number:

    IXTP76P10T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.3

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    1000 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    76 A

  • Drain-source On Resistance-Max:

    0.025 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    298 W

  • Pulsed Drain Current-Max (IDM):

    230 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXTP76P10T Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for IXTP76P10T is a standard TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • Yes, IXTP76P10T is a high-reliability device that meets the requirements of AEC-Q101, making it suitable for use in automotive and other high-reliability applications.
  • To ensure the thermal performance of IXTP76P10T, it is recommended to use a heat sink with a thermal resistance of less than 10°C/W and to ensure good thermal contact between the device and the heat sink.
  • Yes, IXTP76P10T is compatible with lead-free soldering processes and meets the requirements of RoHS and WEEE directives.
  • The maximum surge current rating of IXTP76P10T is 100A for 10ms, making it suitable for use in applications that require high surge current capability.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

IXTP76P10T Overview

Use the download button to access the IXTP76P10T schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like IXTP7, or try a keyword search, such as Power Field-Effect Transistors

Parts related to IXTP76P10T

Showing 0 results