The recommended PCB footprint for the IXTP96P085T is a standard TO-220 package with a minimum pad size of 70 mils x 70 mils (1.78 mm x 1.78 mm) and a thermal pad size of 100 mils x 100 mils (2.54 mm x 2.54 mm).
While the IXTP96P085T has a high junction temperature rating of 150°C, it's essential to consider the thermal management and heat dissipation in your design. Ensure that the device is properly heat-sinked, and the ambient temperature is within the recommended operating range to prevent thermal runaway.
To select the correct heat sink, consider the device's power dissipation, ambient temperature, and airflow. A heat sink with a thermal resistance of 1-2°C/W is recommended. You can use online heat sink calculators or consult with a thermal management expert to determine the optimal heat sink for your application.
The IXTP96P085T has a maximum surge current rating of 100 A for 10 ms. However, it's essential to consider the device's thermal limitations and ensure that the surge current does not exceed the maximum junction temperature rating.
Yes, the IXTP96P085T can be used in a parallel configuration to increase the overall current handling capability. However, it's crucial to ensure that the devices are properly matched, and the current sharing is balanced to prevent thermal runaway or uneven stress on the devices.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
IXTP96P085T Overview
Use the download button to access the IXTP96P085T schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like IXTP9,
or try a keyword search, such as Power Field-Effect Transistors
Suggested Parts
If you searched for IXTP96P085T, you might also be interested in these parts:
