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IXTT140P10T - LITTELFUSE

Description: MOSFET P-Channel: Standard MOSFET

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IXTT140P10T - LITTELFUSE  - 3D model
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IXTT140P10T Details

  • Manufacturer Part Number:

    IXTT140P10T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.9

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    2500 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    140 A

  • Drain-source On Resistance-Max:

    0.01 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    700 pF

  • JEDEC-95 Code:

    TO-268AA

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    568 W

  • Pulsed Drain Current-Max (IDM):

    400 A

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXTT140P10T Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXTT140P10T is a standard SOT-227 package with a minimum pad size of 2.5mm x 2.5mm and a maximum pad size of 3.5mm x 3.5mm.
  • Yes, the IXTT140P10T is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the device's performance and reliability may degrade at temperatures above 125°C.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes thermal stress on the device.
  • The IXTT140P10T should be stored in a dry, cool place with a temperature range of 5°C to 30°C and a relative humidity of 60% or less. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.
  • Yes, the IXTT140P10T is designed to withstand vibrations up to 10G peak acceleration. However, it's recommended to follow proper PCB design and assembly guidelines to ensure the device remains securely attached to the board.

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IXTT140P10T Overview

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