Please enter a minimum 3 letters or numbers
Technical Content
Part Image

IXTT16N10D2 - LITTELFUSE

Description: Depletion Mode MOSFET N-Channel

Download IXTT16N10D2 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
IXTT16N10D2 - LITTELFUSE - PCB symbol
click to zoom
PCB Footprints
IXTT16N10D2 - LITTELFUSE PCB footprint - Other - Other - IXTT (TO-268)
click to zoom
3D Models
IXTT16N10D2 - LITTELFUSE - 3D model - Other - IXTT (TO-268)
click to zoom

IXTT16N10D2 Details

  • Manufacturer Part Number:

    IXTT16N10D2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    0

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    16 A

  • Drain-source On Resistance-Max:

    0.064 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    940 pF

  • JEDEC-95 Code:

    TO-268AA

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    DEPLETION MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    830 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    410 ns

  • Turn-on Time-Max (ton):

    88 ns

IXTT16N10D2 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXTT16N10D2 is a standard TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • To ensure proper cooling, a heat sink with a thermal resistance of 10°C/W or lower is recommended. Additionally, a thermal interface material (TIM) with a thermal conductivity of 1 W/m-K or higher should be used to fill the gap between the device and the heat sink.
  • The maximum allowed voltage transient for the IXTT16N10D2 is 400V for a duration of 100ms or less. Exceeding this limit may damage the device.
  • Yes, the IXTT16N10D2 is suitable for high-reliability applications. It is manufactured using a high-reliability process and is screened to ensure a low defect rate. However, it is recommended to follow the manufacturer's recommended derating guidelines to ensure the device operates within its specified limits.
  • To protect the IXTT16N10D2 from ESD, it is recommended to handle the device in an ESD-controlled environment, use ESD-protective packaging, and follow proper grounding procedures during assembly and testing.

Trust Checks

This model has been provided by an expert contributor.
Expert Contribution
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

IXTT16N10D2 Overview

Use the download button to access the IXTT16N10D2 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like IXTT1, or try a keyword search, such as Power Field-Effect Transistors

Parts related to IXTT16N10D2

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑