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IXTT360N055T2 - LITTELFUSE

Description: N-Channel 55 V 360A (Tc) 935W (Tc) Surface Mount TO-268AA

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Symbol
IXTT360N055T2 - LITTELFUSE - PCB symbol
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PCB Footprints
IXTT360N055T2 - LITTELFUSE PCB footprint - Other - Other - TO-268 _2022
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3D Models
IXTT360N055T2 - LITTELFUSE - 3D model - Other - TO-268 _2022
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IXTT360N055T2 Details

  • Manufacturer Part Number:

    IXTT360N055T2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.6

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    960 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    55 V

  • Drain Current-Max (ID):

    360 A

  • Drain-source On Resistance-Max:

    0.0024 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    480 pF

  • JEDEC-95 Code:

    TO-268AA

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    935 W

  • Pulsed Drain Current-Max (IDM):

    900 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXTT360N055T2 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXTT360N055T2 can be found in the Littelfuse application note AN9313, which provides a detailed layout and footprint recommendation for this device.
  • To ensure reliable soldering of the IXTT360N055T2, follow the recommended soldering profile and guidelines provided in the Littelfuse application note AN9313. Additionally, use a solder with a melting point above 217°C (423°F) and avoid excessive soldering temperatures or times.
  • The maximum allowed voltage imbalance across the IXTT360N055T2 is ±10% of the rated voltage. Exceeding this imbalance may affect the device's performance and reliability.
  • The IXTT360N055T2 is rated for operation up to 150°C (302°F). However, derating may be necessary for high-temperature applications. Consult the datasheet and Littelfuse application notes for guidance on high-temperature operation.
  • The IXTT360N055T2 is an electrostatic discharge (ESD) sensitive device. Handle the device with ESD-protective equipment and follow proper ESD handling procedures to prevent damage.

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IXTT360N055T2 Overview

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