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IXTX110N20L2 - LITTELFUSE

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IXTX110N20L2 Details

  • Manufacturer Part Number:

    IXTX110N20L2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    5000 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    200 V

  • Drain Current-Max (ID):

    110 A

  • Drain-source On Resistance-Max:

    0.024 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    320 pF

  • JESD-30 Code:

    R-PSIP-T3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    960 W

  • Pulsed Drain Current-Max (IDM):

    275 A

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

IXTX110N20L2 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXTX110N20L2 is a standard TO-220 package with a minimum pad size of 4.5mm x 4.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • While the IXTX110N20L2 is primarily designed for low-frequency applications, it can be used in high-frequency applications up to 100 kHz with proper PCB layout and design considerations. However, it's essential to consult with Littelfuse's application engineers to ensure the device meets the specific requirements of your high-frequency application.
  • To ensure proper cooling, it's essential to provide a sufficient heat sink and thermal interface material (TIM) between the device and the heat sink. The heat sink should be designed to dissipate the maximum power dissipation of the device, which is 110A. Additionally, the PCB should be designed with thermal vias and a solid copper plane to help dissipate heat.
  • Yes, the IXTX110N20L2 is compatible with lead-free soldering processes. Littelfuse Inc. has qualified the device for use with lead-free soldering processes, and it meets the requirements of the RoHS directive.
  • The IXTX110N20L2 should be stored in a dry, cool place away from direct sunlight and moisture. The device should be handled with anti-static precautions, such as using an anti-static wrist strap or mat, to prevent damage from electrostatic discharge (ESD).

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IXTX110N20L2 Overview

Use the download button to access the IXTX110N20L2 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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