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IXTX240N075L2 - LITTELFUSE

Description: MOSFET MSFT N-CH LINEAR L2

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IXTX240N075L2 - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247  height 5.21
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IXTX240N075L2 - LITTELFUSE  - 3D model - Transistor Outline, Vertical - TO-247  height 5.21
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IXTX240N075L2 Details

  • Manufacturer Part Number:

    IXTX240N075L2

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    3000 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    75 V

  • Drain Current-Max (ID):

    240 A

  • Drain-source On Resistance-Max:

    0.007 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    1470 pF

  • JESD-30 Code:

    R-PSFM-T3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    960 W

  • Pulsed Drain Current-Max (IDM):

    720 A

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

IXTX240N075L2 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for IXTXN075L2 is a 5x6mm pad with a 3.5mm x 3.5mm thermal pad in the center. The datasheet provides a recommended land pattern, but it's essential to consult the manufacturer's application notes for detailed guidance.
  • While IXTXN075L2 has a maximum operating temperature of 150°C, it's essential to consider the device's power dissipation and thermal management. Littelfuse recommends derating the device's current handling capability at higher temperatures. Consult the datasheet and application notes for guidance on thermal management and derating.
  • To ensure the reliability of IXTXN075L2 in a high-reliability application, follow Littelfuse's recommended assembly and soldering guidelines. Additionally, consider implementing a robust testing and inspection process, including environmental stress screening and burn-in testing, to identify any potential defects or weaknesses.
  • IXTXN075L2 is designed for high-frequency switching applications, but it's essential to consider the device's parasitic inductance and capacitance, as well as the PCB layout and design guidelines. Consult Littelfuse's application notes and simulation models to ensure the device meets your specific application requirements.
  • To prevent damage and ensure the reliability of IXTXN075L2, follow Littelfuse's recommended storage and handling procedures, including proper packaging, handling, and moisture protection. Consult the manufacturer's documentation and industry standards, such as IPC-A-610, for guidance.

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IXTX240N075L2 Overview

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