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IXXK100N60B3H1 - LITTELFUSE

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IXXK100N60B3H1 Details

  • Manufacturer Part Number:

    IXXK100N60B3H1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.25

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    200 A

  • Collector-Emitter Voltage-Max:

    600 V

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • Gate-Emitter Thr Voltage-Max:

    5.5 V

  • Gate-Emitter Voltage-Max:

    20 V

  • JEDEC-95 Code:

    TO-264AA

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    695 W

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    350 ns

  • Turn-on Time-Nom (ton):

    92 ns

  • VCEsat-Max:

    1.8 V

IXXK100N60B3H1 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXXK100N60B3H1 is a TO-247-3L package with a minimum pad size of 5.5mm x 4.5mm and a thermal pad size of 3.5mm x 3.5mm.
  • Yes, the IXXK100N60B3H1 is suitable for high-frequency switching applications up to 100 kHz, but it's essential to consider the device's switching losses, gate drive requirements, and thermal management to ensure reliable operation.
  • To ensure proper cooling, provide a sufficient heat sink with a thermal resistance of ≤ 1°C/W, and apply a thermal interface material (TIM) with a thermal conductivity of ≥ 5 W/m-K between the device and heat sink. Also, ensure good airflow around the heat sink.
  • The maximum allowed voltage transient for the IXXK100N60B3H1 is 600 V, but it's recommended to limit transients to ≤ 450 V to ensure reliable operation and prevent damage to the device.
  • Yes, you can parallel multiple IXXK100N60B3H1 devices to increase current handling, but it's crucial to ensure that each device has an identical thermal environment and is driven by a single gate driver to prevent current imbalance and oscillations.

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IXXK100N60B3H1 Overview

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