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KA5L0380RYDTU - onsemi

Description: Power Switch 3A 4 Pin TO220F

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PCB Footprints
KA5L0380RYDTU - onsemi PCB footprint - Other - Other - TO−220 FULLPAK 4LD LF CASE 340BK ISSUE O_1
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KA5L0380RYDTU Details

  • Manufacturer Part Number:

    KA5L0380RYDTU

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220-4 FullPak

  • Package Description:

    TO-220F, 4 PIN

  • Manufacturer Package Code:

    340BK

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    28 V

  • Input Voltage-Min:

    9.6 V

  • Input Voltage-Nom:

    28 V

  • JESD-30 Code:

    R-XZFM-T4

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    12 A

  • Output Voltage-Max:

    5.2 V

  • Output Voltage-Min:

    4.8 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    ZFM

  • Package Equivalence Code:

    ZIP4(UNSPEC)

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    19.3 mm

  • Supply Current-Max (Isup):

    12 mA

  • Surface Mount:

    NO

  • Switcher Configuration:

    SINGLE

  • Switching Frequency-Max:

    55 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    ZIG-ZAG

  • Width:

    4.5 mm

KA5L0380RYDTU Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, ensure proper PCB layout, and consider using a thermal interface material (TIM) between the device and heat sink. Also, follow the recommended operating conditions and derating guidelines.
  • Use a shielded enclosure, ensure proper PCB layout and grounding, and consider adding EMI filters or chokes to the input and output lines. Also, follow onsemi's recommended layout guidelines and consider using a common-mode choke.
  • Choose capacitors with low ESR, high ripple current rating, and a voltage rating that meets or exceeds the maximum input voltage. Consider using X7R or X5R dielectric capacitors and follow onsemi's recommended capacitor selection guidelines.
  • Monitor input voltage, output voltage, output current, and temperature. Implement overvoltage protection (OVP), undervoltage protection (UVP), and overcurrent protection (OCP) mechanisms to ensure reliable operation and prevent damage.

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KA5L0380RYDTU Overview

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