GeneSic recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat. A minimum of 2oz copper thickness is recommended.
Ensure proper heat sinking, use a thermally conductive material for the heat sink, and maintain a maximum junction temperature of 150°C. Also, follow the recommended derating curves for current and voltage.
The KBU6A can withstand a surge current of up to 10 times the rated current for a duration of 10ms, but this should not be repeated more than 10 times per minute.
Yes, but it's crucial to ensure that the devices are matched in terms of voltage drop and current handling to prevent uneven current sharing. Also, the total current rating should not exceed the recommended maximum current.
GeneSic recommends a gate resistance of 10-20 ohms to minimize ringing and ensure stable operation.
Trust Checks
This model has been provided by an expert contributor.
Expert Contribution
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
KBU6A Overview
Use the download button to access the KBU6A schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search
or try a keyword search, such as Bridge Rectifier Diodes