Part Image

KBU8G - GeneSiC Semiconductor

Description: Bridge Rectifiers 400V 8A Bridge Rectifier

Download KBU8G Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
KBU8G - GeneSiC Semiconductor PCB footprint - Other - Other - KBU8
click to zoom
3D Models
KBU8G - GeneSiC Semiconductor  - 3D model - Other - KBU8
click to zoom

KBU8G Details

  • Manufacturer Part Number:

    KBU8G

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    GeneSic Semiconductor Inc

  • YTEOL:

    6.85

  • Breakdown Voltage-Min:

    400 V

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JESD-30 Code:

    R-PSFM-W4

  • Non-rep Pk Forward Current-Max:

    300 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    6 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Rep Pk Reverse Voltage-Max:

    400 V

  • Surface Mount:

    NO

  • Terminal Form:

    WIRE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

KBU8G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the KBU8G is -55°C to 175°C.
  • To ensure proper biasing, connect the gate to a voltage source through a resistor, and ensure the drain-source voltage is within the recommended range. Consult the datasheet for specific biasing requirements.
  • To minimize thermal resistance, use a thermal pad on the PCB, and ensure good thermal conductivity between the device and the heat sink. A recommended layout is to have a large copper area under the device, connected to a heat sink or thermal pad.
  • To protect the KBU8G from ESD, handle the device in an ESD-controlled environment, use ESD-protective packaging, and ensure all equipment and tools are properly grounded.
  • Store the KBU8G in its original packaging, in a dry, cool place, away from direct sunlight. Handle the device by the body, avoiding touching the leads or die. Use anti-static wrist straps and mats when handling the device.

Trust Checks

This model has been verified by system checks.
System Verified
Sponsored

KBU8G Overview

Use the download button to access the KBU8G schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search or try a keyword search, such as Bridge Rectifier Diodes

Parts related to KBU8G

Showing 0 results