3D Models
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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for L6004D8TP
- Part Number L6004D8TP
- Manufacturer LITTELFUSE
- Last Modified Date Oct 6, 2025 1:29 PM UTC
- Pinout / Pin List Click Here (Member Only)
L6004D8TP Details
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Manufacturer Part Number:
L6004D8TP
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Pbfree Code:
No
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Part Package Code:
TO-252AA
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Pin Count:
3
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ECCN Code:
EAR99
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HTS Code:
8541.30.00.80
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Manufacturer:
Littelfuse Inc
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YTEOL:
6
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Case Connection:
MAIN TERMINAL 2
L6004D8TP Frequently Asked Questions (FAQs)
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The recommended PCB layout for optimal thermal performance of the L6004D8TP includes a thermal pad on the bottom of the device, a solid copper pour on the top and bottom layers, and thermal vias to connect the top and bottom layers. This layout helps to dissipate heat efficiently and reduce thermal resistance.
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To ensure the reliability of the L6004D8TP in high-temperature applications, it is recommended to follow the derating curves provided in the datasheet, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider using a thermally conductive substrate and a heat sink if necessary.
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The maximum surge current that the L6004D8TP can withstand is not explicitly stated in the datasheet. However, according to Littelfuse's application notes, the device can withstand surge currents up to 100A for 10ms. It is recommended to consult with Littelfuse's technical support for specific application requirements.
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Yes, the L6004D8TP can be used in parallel to increase the current rating. However, it is essential to ensure that the devices are properly matched, and the PCB layout is designed to minimize current imbalance and thermal mismatch between the devices.
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The recommended storage temperature range for the L6004D8TP is -40°C to 125°C. Storage outside this range may affect the device's reliability and performance.
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L6004D8TP Overview
Use the download button to access the L6004D8TP 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
