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LT1130ACSW#PBF - Analog Devices

Description: Advanced Low Power 5V RS232 Drivers/Receivers with Small Capacitors (Includes LT1130 thru LT1141)

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LT1130ACSW#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - SW Package 28-Lead Plastic Small Outline (Wide 0.300) (LTC DWG # 05-08-1620)
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3D Models
LT1130ACSW#PBF - Analog Devices  - 3D model - Small Outline Packages - SW Package 28-Lead Plastic Small Outline (Wide 0.300) (LTC DWG # 05-08-1620)
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LT1130ACSW#PBF Details

  • Manufacturer Part Number:

    LT1130ACSW#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    0.300 INCH, PLASTIC, SOP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    05-08-1620 (SW28)

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Differential Output:

    NO

  • Driver Number of Bits:

    5

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    17.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    5

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    600 ns

  • Receiver Number of Bits:

    5

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    1300 ns

  • Width:

    7.5 mm

LT1130ACSW#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT1130 involves keeping the input and output traces short and separate, using a solid ground plane, and placing the input and output capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the output capacitor has a low ESR and is properly decoupled from the output voltage. Additionally, adding a small capacitor (e.g., 10nF) between the output and ground can help to improve stability.
  • The maximum input voltage that can be applied to the LT1130 is 15V. Exceeding this voltage can cause damage to the device. It's recommended to add input voltage protection, such as a voltage clamp or a TVS diode, to prevent overvoltage conditions.
  • The LT1130 is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's recommended to derate the output current and voltage at high temperatures to ensure reliable operation.
  • The output voltage ripple of the LT1130 can be calculated using the formula: ΔVout = (Iout * ESR) / (f * Cout), where Iout is the output current, ESR is the equivalent series resistance of the output capacitor, f is the switching frequency, and Cout is the output capacitance.

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LT1130ACSW#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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