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LT1161CSW#PBF - Analog Devices

Description: Linear Technology LT1161CSW#PBF, Quad MOSFET Power Driver,, 8 to 48 V, Non-Inverting, 20-Pin SOIC

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LT1161CSW#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - SW20
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LT1161CSW#PBF - Analog Devices  - 3D model - Small Outline Packages - SW20
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LT1161CSW#PBF Details

  • Manufacturer Part Number:

    LT1161CSW#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    05-08-1620 (SW20)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • High Side Driver:

    YES

  • Input Characteristics:

    GATED SCHMITT TRIGGER

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    12.8015 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    70 °C

  • Output Characteristics:

    TOTEM-POLE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP20,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.642 mm

  • Supply Current-Max:

    6.5 mA

  • Supply Voltage-Max:

    48 V

  • Supply Voltage-Min:

    12 V

  • Supply Voltage-Nom:

    24 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    200 µs

  • Turn-on Time:

    400 µs

  • Width:

    7.49 mm

LT1161CSW#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT1161CSW#PBF involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a low-ESR capacitor for the output filter and to keep the input and output capacitors close to the device.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Additionally, ensure that the output capacitor is properly sized and that the device is operated within its recommended operating conditions. If oscillations occur, try adding a small capacitor (e.g., 10nF) between the output and ground.
  • The LT1161CSW#PBF can handle input voltages up to 15V, but it's recommended to operate within the specified input voltage range (7V to 12V) for optimal performance and reliability.
  • The LT1161CSW#PBF is rated for operation up to 125°C, but its performance may degrade at high temperatures. Ensure that the device is properly heat-sinked and that the operating conditions are within the recommended specifications.
  • To troubleshoot issues, start by verifying the PCB layout and component values. Check for any signs of overheating, and ensure that the input voltage and output load are within the recommended specifications. Use an oscilloscope to monitor the output voltage and input voltage, and check for any signs of oscillations or noise.

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LT1161CSW#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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