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LT1181ACSW#PBF - Analog Devices

Description: LT1181ACSW#PBF, Line Transceiver, EIA-232, RS-232 2-TX 2-RX 2-TRX, 5 V, 16-Pin SOIC W

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LT1181ACSW#PBF - Analog Devices - PCB symbol
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LT1181ACSW#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - SW(SOP)
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LT1181ACSW#PBF - Analog Devices - 3D model - Small Outline Packages - SW(SOP)
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LT1181ACSW#PBF Details

  • Manufacturer Part Number:

    LT1181ACSW#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    0.300 INCH, LEAD FREE, PLASTIC, SOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1620 (SW16)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Differential Output:

    NO

  • Driver Number of Bits:

    2

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    70 °C

  • Output Characteristics:

    TOTEM-POLE

  • Output Polarity:

    INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    600 ns

  • Receiver Number of Bits:

    2

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    1300 ns

  • Width:

    7.5 mm

LT1181ACSW#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT1181ACSW involves keeping the input and output capacitors close to the IC, using a solid ground plane, and minimizing the length of the input and output traces. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the output capacitor has a low ESR and is properly sized for the output voltage and current. Additionally, avoid using long input and output traces, and keep the input and output capacitors close to the IC.
  • The maximum ambient temperature range for the LT1181ACSW is -40°C to 125°C. However, the device can operate at a junction temperature of up to 150°C.
  • Yes, the LT1181ACSW is suitable for high-reliability applications. It is manufactured using a high-reliability process and is screened to ensure high reliability. However, it is essential to follow proper design and manufacturing practices to ensure the reliability of the final product.
  • To troubleshoot issues with the LT1181ACSW, start by checking the input voltage, output voltage, and output current. Verify that the input and output capacitors are properly sized and that the PCB layout is correct. Check for any signs of overheating, and ensure that the device is operated within its recommended operating conditions.

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LT1181ACSW#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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