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LT1719CS8#PBF - Analog Devices

Description: LT1719CS8#PBF, Comparator 3 V, 5 V 8-Pin SOIC N

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LT1719CS8#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 8-LEAD PLASTIC SO
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LT1719CS8#PBF - Analog Devices  - 3D model - Small Outline Packages - 8-LEAD PLASTIC SO
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LT1719CS8#PBF Details

  • Manufacturer Part Number:

    LT1719CS8#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    0.150 INCH, LEAD FREE, PLASTIC, SOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1610 (S8)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Amplifier Type:

    COMPARATOR

  • Input Offset Voltage-Max:

    3500 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -6 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Output Type:

    TOTEM POLE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Response Time-Nom:

    7 ns

  • Seated Height-Max:

    1.752 mm

  • Supply Current-Max:

    9 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

LT1719CS8#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT1719CS8 involves keeping the input and output traces short and wide, using a solid ground plane, and placing the input and output capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the input and output capacitors are of high quality and have low ESR. Additionally, avoid using long input and output traces, and keep the device away from noise sources.
  • The maximum power dissipation of the LT1719CS8 is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, this value can be derated at higher temperatures.
  • The LT1719CS8 is rated for operation from -40°C to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's recommended to derate the power dissipation and ensure good thermal management to ensure reliable operation in high-temperature environments.
  • To troubleshoot issues with the LT1719CS8, start by checking the input and output voltages, and ensuring that the device is properly powered. Check for any signs of overheating, and verify that the PCB layout and component values are correct. Use an oscilloscope to check for any oscillations or noise on the input and output signals.

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LT1719CS8#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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