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LT1737CGN#PBF - Analog Devices

Description: IC REG CTRLR FLYBACK 16SSOP

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LT1737CGN#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - GN Package 16-Lead Plastic SSOP (Narrow 0.150)_1
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LT1737CGN#PBF - Analog Devices  - 3D model - Small Outline Packages - GN Package 16-Lead Plastic SSOP (Narrow 0.150)_1
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LT1737CGN#PBF Details

  • Manufacturer Part Number:

    LT1737CGN#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    0.150 INCH, PLASTIC, SSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1641 (GN16)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    20 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    14 V

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    100 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    15 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    SINGLE

  • Switching Frequency-Max:

    250 kHz

  • Technology:

    BIPOLAR

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9116 mm

LT1737CGN#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT1737CGN#PBF involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce parasitic inductance and capacitance. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Additionally, ensure that the output capacitor has a low ESR (Equivalent Series Resistance) and is properly sized for the output voltage and current. A minimum output capacitance of 10uF is recommended.
  • The LT1737CGN#PBF has an operating ambient temperature range of -40°C to 125°C. However, the device's performance and reliability may degrade at extreme temperatures. It's recommended to operate the device within a temperature range of -20°C to 85°C for optimal performance.
  • Yes, the LT1737CGN#PBF is suitable for high-reliability and automotive applications. It has a high MTBF (Mean Time Between Failures) rating and is AEC-Q100 qualified, making it suitable for use in harsh environments.
  • To troubleshoot issues with the LT1737CGN#PBF, start by checking the input voltage, output voltage, and output current. Verify that the device is properly powered and that the output capacitor is properly sized. Check for any signs of overheating, such as excessive temperature or thermal shutdown. Use an oscilloscope to check for any oscillations or noise on the output.

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LT1737CGN#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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