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LT1776CN8 - Analog Devices

Description: IC REG BUCK ADJ 0.55A 8DIP

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PCB Footprints
LT1776CN8 - Analog Devices PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - N8 Package 8-Lead PDIP (Narrow 0.300)
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3D Models
LT1776CN8 - Analog Devices  - 3D model - Dual-In-Line Packages - N8 Package 8-Lead PDIP (Narrow 0.300)
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LT1776CN8 Details

  • Manufacturer Part Number:

    LT1776CN8

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    60 V

  • Input Voltage-Min:

    7.4 V

  • Input Voltage-Nom:

    40 V

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e0

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Output Current-Max:

    0.7 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.937 mm

  • Surface Mount:

    NO

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    230 kHz

  • Technology:

    BIPOLAR

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

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LT1776CN8 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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