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LT1965EMS8E#TRPBF - Analog Devices

Description: LDO Regulator Pos 1.2V to 19.5V 1.1A Automotive 8-Pin MSOP EP T/R

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LT1965EMS8E#TRPBF - Analog Devices - PCB symbol
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LT1965EMS8E#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MS8E Package 8-Lead Plastic MSOP,
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LT1965EMS8E#TRPBF - Analog Devices - 3D model - Small Outline Packages - MS8E Package 8-Lead Plastic MSOP,
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LT1965EMS8E#TRPBF Details

  • Manufacturer Part Number:

    LT1965EMS8E#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1662

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustability:

    ADJUSTABLE

  • Dropout Voltage1-Max:

    0.49 V

  • Dropout Voltage1-Nom:

    0.31 V

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Line Regulation-Max (%/V):

    0.0372

  • Load Regulation-Max(%):

    1.3333%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    1.1 A

  • Output Voltage1-Max:

    19.5 V

  • Output Voltage1-Min:

    1.2 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LT1965EMS8E#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good airflow around the device. The datasheet provides some guidelines, but a more detailed application note from Analog Devices provides additional recommendations.
  • To ensure a stable and accurate output voltage, it's essential to follow proper layout and decoupling techniques, use a stable input voltage, and select the correct output capacitor. Additionally, the datasheet provides a formula to calculate the output voltage, and the application note provides more detailed guidance.
  • The maximum input voltage that can be applied to the LT1965EMS8E#TRPBF is 15V, as specified in the datasheet. Exceeding this voltage can cause damage to the device.
  • The LT1965EMS8E#TRPBF is rated for operation up to 125°C, but the device's performance and reliability may degrade at higher temperatures. It's essential to follow the recommended operating conditions and derate the device's performance accordingly.
  • To troubleshoot issues with the LT1965EMS8E#TRPBF, start by checking the input voltage, output voltage, and current consumption. Verify that the device is properly connected and that the PCB layout is correct. Consult the datasheet and application notes for guidance on troubleshooting common issues.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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