SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Regulator Type:
ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR
Seated Height-Max:
1.1 mm
Surface Mount:
YES
Technology:
BIPOLAR
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Width:
3 mm
LT3011HMSE#PBF Frequently Asked Questions (FAQs)
A good PCB layout for optimal thermal performance involves placing the device on a solid copper plane, using thermal vias to connect the plane to the device's thermal pad, and keeping the plane as close to the device as possible. Additionally, it's recommended to use a 4-layer board with a solid ground plane and to avoid routing high-current traces near the device.
To ensure stability, it's essential to follow the recommended compensation network and output capacitor values, as well as to keep the input and output capacitors close to the device. Additionally, it's recommended to use a low-ESR output capacitor and to avoid using ceramic capacitors with high ESL values.
The maximum output current of the LT3011HMSE#PBF is 1.5A, but it's limited by the device's thermal performance and the output voltage. It's recommended to derate the output current based on the output voltage and the ambient temperature to ensure reliable operation.
The LT3011HMSE#PBF is rated for operation up to 125°C, but it's essential to consider the device's thermal performance and derate the output current accordingly. Additionally, it's recommended to use a heat sink or a thermal interface material to improve heat dissipation.
To protect the device from input voltage transients and surges, it's recommended to use a TVS diode or a transient voltage suppressor at the input, as well as to add a series resistor and a capacitor to filter out high-frequency noise.
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LT3011HMSE#PBF Overview
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