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LT3667EMSE#TRPBF - Analog Devices

Description: LINEAR TECHNOLOGY - LT3667EMSE#TRPBF - Power Management IC, 40 V 400 mA Step Down Switching Regulator, Dual LDO, 4.3 V to 40 V in, MSOP-16

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LT3667EMSE#TRPBF - Analog Devices - PCB symbol
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PCB Footprints
LT3667EMSE#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MSE Package 16--Lead Plastic MSOP, Exposed Die Pad
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LT3667EMSE#TRPBF - Analog Devices - 3D model - Small Outline Packages - MSE Package 16--Lead Plastic MSOP, Exposed Die Pad
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LT3667EMSE#TRPBF Details

  • Manufacturer Part Number:

    LT3667EMSE#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1667

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    40 V

  • Input Voltage-Min:

    4.3 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.039 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Output Current-Max:

    0.95 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2100 kHz

  • Technology:

    BIPOLAR

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LT3667EMSE#TRPBF Frequently Asked Questions (FAQs)

  • The maximum input voltage that can be applied to the LT3667EMSE is 28V, but it's recommended to operate within the specified input voltage range of 3.5V to 25V for optimal performance and reliability.
  • To ensure the stability of the output voltage, it's essential to follow the recommended layout and component selection guidelines, including the use of a suitable output capacitor, input capacitor, and feedback resistors. Additionally, the output voltage should be decoupled from the input voltage using a capacitor.
  • The minimum input voltage required for the LT3667EMSE to operate is 3.5V, but it's recommended to operate above 4V for optimal performance and to ensure that the output voltage is within the specified range.
  • The LT3667EMSE is rated for operation up to 125°C, but it's essential to consider the thermal derating and ensure that the device is properly heat-sinked to prevent overheating. Additionally, the device's performance and reliability may be affected at high temperatures, so it's recommended to consult the datasheet and application notes for more information.
  • The output voltage of the LT3667EMSE can be calculated using the formula: VOUT = 0.8V x (1 + R1/R2), where R1 and R2 are the feedback resistors. The output voltage can be adjusted by changing the values of R1 and R2.

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LT3667EMSE#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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