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LT6657AHMS8-3#TRPBF - Analog Devices

Description: Voltage References 1.5ppm/ C Drift, L N, Bufed Ref

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LT6657AHMS8-3#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MS8 Package 8-Lead
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LT6657AHMS8-3#TRPBF - Analog Devices  - 3D model - Small Outline Packages - MS8 Package 8-Lead
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LT6657AHMS8-3#TRPBF Details

  • Manufacturer Part Number:

    LT6657AHMS8-3#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1660

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    THREE TERMINAL VOLTAGE REFERENCE

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    3.003 V

  • Output Voltage-Min:

    2.997 V

  • Output Voltage-Nom:

    3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    40 V

  • Supply Voltage-Min (Vsup):

    3.5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temp Coef of Voltage-Max:

    1.5 ppm/°C

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trim/Adjustable Output:

    NO

  • Width:

    3 mm

LT6657AHMS8-3#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT6657AHMS8-3 involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce noise and parasitic inductance. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability, make sure to follow the recommended capacitor values and types, and keep the output capacitor ESR within the recommended range. Also, avoid using capacitors with high ESL or ESR, and keep the feedback loop impedance low. Additionally, a small series resistor (e.g., 1-10 ohms) can be added to the output to improve stability.
  • The maximum output current of the LT6657AHMS8-3 is 20mA, but it's recommended to limit the output current to 10mA or less to ensure reliable operation and minimize thermal issues.
  • Yes, the LT6657AHMS8-3 can be used as a voltage reference for an ADC or DAC, but it's essential to consider the noise and temperature coefficient of the device. The LT6657AHMS8-3 has a low noise output (typically 10uVrms) and a low temperature coefficient (typically 2ppm/C), making it suitable for many precision applications.
  • The power dissipation of the LT6657AHMS8-3 can be calculated using the formula: Pd = (Vin - Vout) x Iout + (Vin x Iq), where Vin is the input voltage, Vout is the output voltage, Iout is the output current, and Iq is the quiescent current (typically 1.5mA). Make sure to consider the thermal resistance of the package and the PCB when calculating the junction temperature.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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