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LT6657BHMS8-5#TRPBF - Analog Devices

Description: Voltage References 3ppm/ C Drift, Low Noise, Buffered Reference

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LT6657BHMS8-5#TRPBF - Analog Devices - PCB symbol
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PCB Footprints
LT6657BHMS8-5#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MS8 Package 8-Lead Plastic MSOP
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LT6657BHMS8-5#TRPBF - Analog Devices - 3D model - Small Outline Packages - MS8 Package 8-Lead Plastic MSOP
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LT6657BHMS8-5#TRPBF Details

  • Manufacturer Part Number:

    LT6657BHMS8-5#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1660

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    THREE TERMINAL VOLTAGE REFERENCE

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    5.005 V

  • Output Voltage-Min:

    4.995 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    40 V

  • Supply Voltage-Min (Vsup):

    5.5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temp Coef of Voltage-Max:

    3 ppm/°C

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trim/Adjustable Output:

    NO

  • Width:

    3 mm

LT6657BHMS8-5#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT6657BHMS8-5#TRPBF involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce noise and parasitic inductance. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability and prevent oscillations, make sure to follow the recommended compensation network and output capacitor values, and ensure that the output capacitor has a low equivalent series resistance (ESR). Additionally, avoid using long output traces and minimize the area of the output loop.
  • The maximum input voltage that can be applied to the LT6657BHMS8-5#TRPBF is 12V, but it's recommended to operate the device within the specified input voltage range of 4.5V to 9V for optimal performance and reliability.
  • While it's possible to use a different output capacitor value or type, it's not recommended as it may affect the stability and performance of the device. The recommended output capacitor values and types are specified in the datasheet to ensure optimal performance and reliability.
  • To handle thermal considerations and heat dissipation, ensure good airflow around the device, use a heat sink if necessary, and follow the recommended thermal design guidelines in the datasheet. The device has a thermal shutdown feature that will activate if the junction temperature exceeds 150°C.

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LT6657BHMS8-5#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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